LED die attach silver paste
LED die attach non-conductive paste
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Product details
Supply Ability
- Warranty(Year)：1 Year
Product Specifications
Product Description
N30 is an one-part thermal curing adhesive, which could be stored at room temperature. It could be used for LED, Ceramic and semiconductor component packaging and adhering. It has a good performance on anti-moisture and dielectric properties.
| UNCURED PROPERTIES | |
| Appearance | Creamy white paste |
| Viscosity@ 25°C (Brookfield CP-51 @ 1 rpm) | 30,000 Cps |
| Work Life @ 25°C | > 72hours |
| Shelf Life @ <25°C | > 3 months |
| CURE PROCESS | |
| Recommended Condition | 60 min @ 135 °C |
| PHYSIOCHEMICAL PROPERTIES-PSOT CURE | |
| Glass Transition TemperatureTg | 110°C |
| Density | 1.2 g/cm3 |
| Dielectric strength/(@mil) | > 1000 VDC |
| Coefficient of Thermal Expansion | 56 ppm/°C Below Tg |
| Light transmissivity | 98% |
| Thermal Conductivity @ 121°C | 0.6 W/mK |
| Shear Strength @ 25°C | > 20Kg/die |
| Tensile Strength @ 25°C | > 2800 psi |
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Year Established: 19YRS
